1# SPDX-License-Identifier: GPL-2.0-only 2# 3# Generic thermal drivers configuration 4# 5 6menuconfig THERMAL 7 bool "Thermal drivers" 8 help 9 Thermal drivers offer a generic mechanism for 10 thermal management. Usually it's made up of one or more thermal 11 zones and cooling devices. 12 Each thermal zone contains its own temperature, trip points, 13 and cooling devices. 14 All platforms with ACPI or Open Firmware thermal support can use 15 this driver. 16 If you want this support, you should say Y here. 17 18if THERMAL 19 20config THERMAL_NETLINK 21 bool "Thermal netlink management" 22 depends on NET 23 help 24 The thermal framework has a netlink interface to do thermal 25 zones discovery, temperature readings and events such as 26 trip point crossed, cooling device update or governor 27 change. It is recommended to enable the feature. 28 29config THERMAL_STATISTICS 30 bool "Thermal state transition statistics" 31 help 32 Export thermal state transition statistics information through sysfs. 33 34 If in doubt, say N. 35 36config THERMAL_DEBUGFS 37 bool "Thermal subsystem debug support" 38 depends on DEBUG_FS 39 help 40 Say Y to allow the thermal subsystem to collect diagnostic 41 information that can be accessed via debugfs. 42 43config THERMAL_EMERGENCY_POWEROFF_DELAY_MS 44 int "Emergency poweroff delay in milli-seconds" 45 default 0 46 help 47 Thermal subsystem will issue a graceful shutdown when 48 critical temperatures are reached using orderly_poweroff(). In 49 case of failure of an orderly_poweroff(), the thermal emergency 50 poweroff kicks in after a delay has elapsed and shuts down the system. 51 This config is number of milliseconds to delay before emergency 52 poweroff kicks in. Similarly to the critical trip point, 53 the delay should be carefully profiled so as to give adequate 54 time for orderly_poweroff() to finish on regular execution. 55 If set to 0 emergency poweroff will not be supported. 56 57 In doubt, leave as 0. 58 59config THERMAL_HWMON 60 bool 61 prompt "Expose thermal sensors as hwmon device" 62 depends on HWMON=y || HWMON=THERMAL 63 default y 64 help 65 In case a sensor is registered with the thermal 66 framework, this option will also register it 67 as a hwmon. The sensor will then have the common 68 hwmon sysfs interface. 69 70 Say 'Y' here if you want all thermal sensors to 71 have hwmon sysfs interface too. 72 73config THERMAL_OF 74 bool 75 prompt "APIs to parse thermal data out of device tree" 76 depends on OF 77 default y 78 help 79 This options provides helpers to add the support to 80 read and parse thermal data definitions out of the 81 device tree blob. 82 83 Say 'Y' here if you need to build thermal infrastructure 84 based on device tree. 85 86config THERMAL_WRITABLE_TRIPS 87 bool "Enable writable trip points" 88 help 89 This option allows the system integrator to choose whether 90 trip temperatures can be changed from userspace. The 91 writable trips need to be specified when setting up the 92 thermal zone but the choice here takes precedence. 93 94 Say 'Y' here if you would like to allow userspace tools to 95 change trip temperatures. 96 97choice 98 prompt "Default Thermal governor" 99 default THERMAL_DEFAULT_GOV_STEP_WISE 100 help 101 This option sets which thermal governor shall be loaded at 102 startup. If in doubt, select 'step_wise'. 103 104config THERMAL_DEFAULT_GOV_STEP_WISE 105 bool "step_wise" 106 select THERMAL_GOV_STEP_WISE 107 help 108 Use the step_wise governor as default. This throttles the 109 devices one step at a time. 110 111config THERMAL_DEFAULT_GOV_FAIR_SHARE 112 bool "fair_share" 113 select THERMAL_GOV_FAIR_SHARE 114 help 115 Use the fair_share governor as default. This throttles the 116 devices based on their 'contribution' to a zone. The 117 contribution should be provided through platform data. 118 119config THERMAL_DEFAULT_GOV_USER_SPACE 120 bool "user_space" 121 select THERMAL_GOV_USER_SPACE 122 help 123 The Userspace governor allows to get trip point crossed 124 notification from the kernel via uevents. It is recommended 125 to use the netlink interface instead which gives richer 126 information about the thermal framework events. 127 128config THERMAL_DEFAULT_GOV_POWER_ALLOCATOR 129 bool "power_allocator" 130 depends on THERMAL_GOV_POWER_ALLOCATOR 131 help 132 Select this if you want to control temperature based on 133 system and device power allocation. This governor can only 134 operate on cooling devices that implement the power API. 135 136config THERMAL_DEFAULT_GOV_BANG_BANG 137 bool "bang_bang" 138 depends on THERMAL_GOV_BANG_BANG 139 help 140 Use the bang_bang governor as default. This throttles the 141 devices one step at the time, taking into account the trip 142 point hysteresis. 143 144endchoice 145 146config THERMAL_GOV_FAIR_SHARE 147 bool "Fair-share thermal governor" 148 help 149 Enable this to manage platform thermals using fair-share governor. 150 151config THERMAL_GOV_STEP_WISE 152 bool "Step_wise thermal governor" 153 help 154 Enable this to manage platform thermals using a simple linear 155 governor. 156 157config THERMAL_GOV_BANG_BANG 158 bool "Bang Bang thermal governor" 159 default n 160 help 161 Enable this to manage platform thermals using bang bang governor. 162 163 Say 'Y' here if you want to use two point temperature regulation 164 used for fans without throttling. Some fan drivers depend on this 165 governor to be enabled (e.g. acerhdf). 166 167config THERMAL_GOV_USER_SPACE 168 bool "User_space thermal governor" 169 help 170 Enable this to let the user space manage the platform thermals. 171 172config THERMAL_GOV_POWER_ALLOCATOR 173 bool "Power allocator thermal governor" 174 depends on ENERGY_MODEL 175 help 176 Enable this to manage platform thermals by dynamically 177 allocating and limiting power to devices. 178 179config CPU_THERMAL 180 bool "Generic cpu cooling support" 181 depends on THERMAL_OF 182 help 183 Enable the CPU cooling features. If the system has no active 184 cooling device available, this option allows to use the CPU 185 as a cooling device. 186 187if CPU_THERMAL 188 189config CPU_FREQ_THERMAL 190 bool "CPU frequency cooling device" 191 depends on CPU_FREQ 192 default y 193 help 194 This implements the generic cpu cooling mechanism through frequency 195 reduction. An ACPI version of this already exists 196 (drivers/acpi/processor_thermal.c). 197 This will be useful for platforms using the generic thermal interface 198 and not the ACPI interface. 199 200config CPU_IDLE_THERMAL 201 bool "CPU idle cooling device" 202 depends on IDLE_INJECT 203 help 204 This implements the CPU cooling mechanism through 205 idle injection. This will throttle the CPU by injecting 206 idle cycle. 207endif 208 209config DEVFREQ_THERMAL 210 bool "Generic device cooling support" 211 depends on PM_DEVFREQ 212 depends on PM_OPP 213 help 214 This implements the generic devfreq cooling mechanism through 215 frequency reduction for devices using devfreq. 216 217 This will throttle the device by limiting the maximum allowed DVFS 218 frequency corresponding to the cooling level. 219 220 In order to use the power extensions of the cooling device, 221 devfreq should use the simple_ondemand governor. 222 223 If you want this support, you should say Y here. 224 225config THERMAL_EMULATION 226 bool "Thermal emulation mode support" 227 help 228 Enable this option to make a emul_temp sysfs node in thermal zone 229 directory to support temperature emulation. With emulation sysfs node, 230 user can manually input temperature and test the different trip 231 threshold behaviour for simulation purpose. 232 233 WARNING: Be careful while enabling this option on production systems, 234 because userland can easily disable the thermal policy by simply 235 flooding this sysfs node with low temperature values. 236 237config THERMAL_MMIO 238 tristate "Generic Thermal MMIO driver" 239 depends on OF 240 depends on HAS_IOMEM 241 help 242 This option enables the generic thermal MMIO driver that will use 243 memory-mapped reads to get the temperature. Any HW/System that 244 allows temperature reading by a single memory-mapped reading, be it 245 register or shared memory, is a potential candidate to work with this 246 driver. 247 248config HISI_THERMAL 249 tristate "Hisilicon thermal driver" 250 depends on ARCH_HISI || COMPILE_TEST 251 depends on HAS_IOMEM 252 depends on OF 253 default y 254 help 255 Enable this to plug hisilicon's thermal sensor driver into the Linux 256 thermal framework. cpufreq is used as the cooling device to throttle 257 CPUs when the passive trip is crossed. 258 259config IMX_THERMAL 260 tristate "Temperature sensor driver for Freescale i.MX SoCs" 261 depends on ARCH_MXC || COMPILE_TEST 262 depends on NVMEM || !NVMEM 263 depends on MFD_SYSCON 264 depends on OF 265 help 266 Support for Temperature Monitor (TEMPMON) found on Freescale i.MX SoCs. 267 It supports one critical trip point and one passive trip point. The 268 cpufreq is used as the cooling device to throttle CPUs when the 269 passive trip is crossed. 270 271config IMX_SC_THERMAL 272 tristate "Temperature sensor driver for NXP i.MX SoCs with System Controller" 273 depends on IMX_SCU 274 depends on OF 275 help 276 Support for Temperature Monitor (TEMPMON) found on NXP i.MX SoCs with 277 system controller inside, Linux kernel has to communicate with system 278 controller via MU (message unit) IPC to get temperature from thermal 279 sensor. It supports one critical trip point and one 280 passive trip point for each thermal sensor. 281 282config IMX8MM_THERMAL 283 tristate "Temperature sensor driver for Freescale i.MX8MM SoC" 284 depends on ARCH_MXC || COMPILE_TEST 285 depends on OF 286 help 287 Support for Thermal Monitoring Unit (TMU) found on Freescale i.MX8MM SoC. 288 It supports one critical trip point and one passive trip point. The 289 cpufreq is used as the cooling device to throttle CPUs when the passive 290 trip is crossed. 291 292config K3_THERMAL 293 tristate "Texas Instruments K3 thermal support" 294 depends on ARCH_K3 || COMPILE_TEST 295 help 296 If you say yes here you get thermal support for the Texas Instruments 297 K3 SoC family. The current chip supported is: 298 - AM654 299 300 This includes temperature reading functionality. 301 302config MAX77620_THERMAL 303 tristate "Temperature sensor driver for Maxim MAX77620 PMIC" 304 depends on MFD_MAX77620 305 depends on OF 306 help 307 Support for die junction temperature warning alarm for Maxim 308 Semiconductor PMIC MAX77620 device. Device generates two alarm 309 interrupts when PMIC die temperature cross the threshold of 310 120 degC and 140 degC. 311 312config QORIQ_THERMAL 313 tristate "QorIQ Thermal Monitoring Unit" 314 depends on THERMAL_OF && HAS_IOMEM 315 depends on PPC_E500MC || SOC_LS1021A || ARCH_LAYERSCAPE || (ARCH_MXC && ARM64) || COMPILE_TEST 316 select REGMAP_MMIO 317 help 318 Support for Thermal Monitoring Unit (TMU) found on QorIQ platforms. 319 It supports one critical trip point and one passive trip point. The 320 cpufreq is used as the cooling device to throttle CPUs when the 321 passive trip is crossed. 322 323config SPEAR_THERMAL 324 tristate "SPEAr thermal sensor driver" 325 depends on PLAT_SPEAR || COMPILE_TEST 326 depends on HAS_IOMEM 327 depends on OF 328 help 329 Enable this to plug the SPEAr thermal sensor driver into the Linux 330 thermal framework. 331 332config SUN8I_THERMAL 333 tristate "Allwinner sun8i thermal driver" 334 depends on ARCH_SUNXI || COMPILE_TEST 335 depends on HAS_IOMEM 336 depends on NVMEM 337 depends on OF 338 depends on RESET_CONTROLLER 339 help 340 Support for the sun8i thermal sensor driver into the Linux thermal 341 framework. 342 343 To compile this driver as a module, choose M here: the 344 module will be called sun8i-thermal. 345 346config ROCKCHIP_THERMAL 347 tristate "Rockchip thermal driver" 348 depends on ARCH_ROCKCHIP || COMPILE_TEST 349 depends on RESET_CONTROLLER 350 depends on HAS_IOMEM 351 help 352 Rockchip thermal driver provides support for Temperature sensor 353 ADC (TS-ADC) found on Rockchip SoCs. It supports one critical 354 trip point. Cpufreq is used as the cooling device and will throttle 355 CPUs when the Temperature crosses the passive trip point. 356 357config RCAR_THERMAL 358 tristate "Renesas R-Car thermal driver" 359 depends on ARCH_RENESAS || COMPILE_TEST 360 depends on HAS_IOMEM 361 help 362 Enable this to plug the R-Car thermal sensor driver into the Linux 363 thermal framework. 364 365config RCAR_GEN3_THERMAL 366 tristate "Renesas R-Car Gen3 and RZ/G2 thermal driver" 367 depends on ARCH_RENESAS || COMPILE_TEST 368 depends on HAS_IOMEM 369 depends on OF 370 help 371 Enable this to plug the R-Car Gen3 or RZ/G2 thermal sensor driver into 372 the Linux thermal framework. 373 374config RZG2L_THERMAL 375 tristate "Renesas RZ/G2L thermal driver" 376 depends on ARCH_RENESAS || COMPILE_TEST 377 depends on HAS_IOMEM 378 depends on OF 379 help 380 Enable this to plug the RZ/G2L thermal sensor driver into the Linux 381 thermal framework. 382 383config KIRKWOOD_THERMAL 384 tristate "Temperature sensor on Marvell Kirkwood SoCs" 385 depends on MACH_KIRKWOOD || COMPILE_TEST 386 depends on HAS_IOMEM 387 depends on OF 388 help 389 Support for the Kirkwood thermal sensor driver into the Linux thermal 390 framework. Only kirkwood 88F6282 and 88F6283 have this sensor. 391 392config DOVE_THERMAL 393 tristate "Temperature sensor on Marvell Dove SoCs" 394 depends on ARCH_DOVE || MACH_DOVE || COMPILE_TEST 395 depends on HAS_IOMEM 396 depends on OF 397 help 398 Support for the Dove thermal sensor driver in the Linux thermal 399 framework. 400 401config DB8500_THERMAL 402 tristate "DB8500 thermal management" 403 depends on MFD_DB8500_PRCMU && OF 404 default y 405 help 406 Adds DB8500 thermal management implementation according to the thermal 407 management framework. A thermal zone with several trip points will be 408 created. Cooling devices can be bound to the trip points to cool this 409 thermal zone if trip points reached. 410 411config ARMADA_THERMAL 412 tristate "Marvell EBU Armada SoCs thermal management" 413 depends on ARCH_MVEBU || COMPILE_TEST 414 depends on HAS_IOMEM 415 depends on OF 416 help 417 Enable this option if you want to have support for thermal management 418 controller present in Marvell EBU Armada SoCs (370,375,XP,38x,7K,8K). 419 420config DA9062_THERMAL 421 tristate "DA9062/DA9061 Dialog Semiconductor thermal driver" 422 depends on MFD_DA9062 || COMPILE_TEST 423 depends on OF 424 help 425 Enable this for the Dialog Semiconductor thermal sensor driver. 426 This will report PMIC junction over-temperature for one thermal trip 427 zone. 428 Compatible with the DA9062 and DA9061 PMICs. 429 430menu "Mediatek thermal drivers" 431depends on ARCH_MEDIATEK || COMPILE_TEST 432source "drivers/thermal/mediatek/Kconfig" 433endmenu 434 435config AMLOGIC_THERMAL 436 tristate "Amlogic Thermal Support" 437 default ARCH_MESON 438 depends on OF && ARCH_MESON 439 help 440 If you say yes here you get support for Amlogic Thermal 441 for G12 SoC Family. 442 443 This driver can also be built as a module. If so, the module will 444 be called amlogic_thermal. 445 446menu "Intel thermal drivers" 447depends on X86 || X86_INTEL_QUARK || COMPILE_TEST 448source "drivers/thermal/intel/Kconfig" 449endmenu 450 451menu "Broadcom thermal drivers" 452depends on ARCH_BCM || ARCH_BRCMSTB || ARCH_BCM2835 || ARCH_BCM_IPROC || \ 453 COMPILE_TEST 454source "drivers/thermal/broadcom/Kconfig" 455endmenu 456 457menu "Texas Instruments thermal drivers" 458depends on ARCH_HAS_BANDGAP || COMPILE_TEST 459depends on HAS_IOMEM 460source "drivers/thermal/ti-soc-thermal/Kconfig" 461endmenu 462 463menu "Samsung thermal drivers" 464depends on ARCH_EXYNOS || COMPILE_TEST 465source "drivers/thermal/samsung/Kconfig" 466endmenu 467 468menu "STMicroelectronics thermal drivers" 469depends on (ARCH_STI || ARCH_STM32) && OF 470source "drivers/thermal/st/Kconfig" 471endmenu 472 473source "drivers/thermal/tegra/Kconfig" 474 475config GENERIC_ADC_THERMAL 476 tristate "Generic ADC based thermal sensor" 477 depends on IIO 478 help 479 This enabled a thermal sysfs driver for the temperature sensor 480 which is connected to the General Purpose ADC. The ADC channel 481 is read via IIO framework and the channel information is provided 482 to this driver. This driver reports the temperature by reading ADC 483 channel and converts it to temperature based on lookup table. 484 485menu "Qualcomm thermal drivers" 486depends on (ARCH_QCOM && OF) || COMPILE_TEST 487source "drivers/thermal/qcom/Kconfig" 488endmenu 489 490config UNIPHIER_THERMAL 491 tristate "Socionext UniPhier thermal driver" 492 depends on ARCH_UNIPHIER || COMPILE_TEST 493 depends on THERMAL_OF && MFD_SYSCON 494 help 495 Enable this to plug in UniPhier on-chip PVT thermal driver into the 496 thermal framework. The driver supports CPU thermal zone temperature 497 reporting and a couple of trip points. 498 499config SPRD_THERMAL 500 tristate "Temperature sensor on Spreadtrum SoCs" 501 depends on ARCH_SPRD || COMPILE_TEST 502 help 503 Support for the Spreadtrum thermal sensor driver in the Linux thermal 504 framework. 505 506config KHADAS_MCU_FAN_THERMAL 507 tristate "Khadas MCU controller FAN cooling support" 508 depends on OF 509 depends on MFD_KHADAS_MCU 510 select MFD_CORE 511 select REGMAP 512 help 513 If you say yes here you get support for the FAN controlled 514 by the Microcontroller found on the Khadas VIM boards. 515 516config LOONGSON2_THERMAL 517 tristate "Loongson-2 SoC series thermal driver" 518 depends on LOONGARCH || COMPILE_TEST 519 depends on OF 520 help 521 Support for Thermal driver found on Loongson-2 SoC series platforms. 522 The thermal driver realizes get_temp and set_trips function, which 523 are used to obtain the temperature of the current node and set the 524 temperature range to trigger the interrupt. When the input temperature 525 is higher than the high temperature threshold or lower than the low 526 temperature threshold, the interrupt will occur. 527 528endif 529